Case Overview
- Heatsink
- United State
- 4 months
- Extrusion, Fabrication
Advanced Thermal Solution for High-Performance Computing
Briefing
A leading computer hardware manufacturer faced a critical challenge in managing the heat generated by their latest high-performance computing systems. They required an innovative and efficient thermal solution to ensure optimal performance and system stability. Kimsen, with its expertise in thermal management, was approached to develop a customized solution that would meet these stringent requirements. This case study highlights the tailored approach and successful implementation of Kimsen’s advanced thermal solutions, resulting in significant performance improvements and a strengthened partnership with the client.
Challenges:
Solutions:
Kimsen designed and manufactured lightweight yet durable aluminum frames with a special surface treatment to resist corrosion and wear. Custom mounting solutions were also provided to ensure easy installation and maintenance.
Kimsen’s engineering team conducted a thorough assessment of the client’s high-performance computing systems to understand the thermal challenges and specific requirements.
- Developed a custom extrusion heatsink and heatpipe heat sink combination tailored to the client’s needs.
- Engineered precision fins and optimized airflow paths to enhance heat dissipation.
- Created prototypes of the custom thermal solution for rigorous testing under real-world operating conditions.
- Conducted thermal performance tests to ensure the solution met the desired cooling efficiency and reliability.
- Finalized the design based on test results and client feedback.
- Manufactured and delivered the customized thermal solutions to the client.
- Provided ongoing technical support to ensure seamless integration and optimal performance of the thermal solutions.
- Worked closely with the client to make any necessary adjustments and optimizations post-implementation.
Results:
The client reported a significant reduction in operating temperatures, improved system stability, and extended component lifespan. The success of this thermal solution led to a long-term partnership with Kim Sen.
